EP2A25F672C7 vs EP2A25F672C9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C7 sa pamamagitan ng Altera at EP2A25F672C9 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C7 | EP2A25F672C9 |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Product Family | APEX II | — |
| Logic Elements | 25,000 | — |
| Maximum System Gates | 1,650,000 | — |
| Maximum RAM Bits | 422,976 | — |
| User I/O Count | 492 | — |
| Packhaging | 672-ball FCBGA (FineLine BGA) | 672-ball FCBGA (FineLine BGA) |
| Process Technology | 0.15-um all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper, up to 8 metal layers |
| Supply Voltage (Core) | 1.5 V | — |
| LVDS Data Rate | 1 Gbps per channel (True-LVDS) | — |
| I/O Standards Supported | LVDS, LVPECL, PCML, HyperTransport | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0°C to 85°C (Commercial) |
| Speed Grade | -7 | — |
| Configuration Mode | Passive Serial, Passive Parallel, JTAG | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED] |
| Embedded System Blocks (ESB) | Yes - RAM, ROM, CAM, multiplier support | — |
| Family | — | APEX II |
| Logic Elements (LE) | — | Approximately 25,000 |
| Macro Cells | — | 2432 |
| User I/O | — | 492 |
| Package Dimensions | — | 27 mm x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Logic Family | — | CMOS |
| Propagation Delay | — | 1.69 ns |
| Volte ng Pagbibigay | — | [DATA_NEEDED: core VCC voltage] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL (multi-voltage 1.5/1.8/2.5/3.3 V) |
| Configuration | — | Passive Serial, Passive Parallel Synchronous, JTAG |
| Embedded Memory | — | ESBs for dual-port RAM, ROM, FIFO |
| Uri ng Pagpapasok | — | Surface Mount |