EP2A40B724C8 vs EP2A40B724C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40B724C8 sa pamamagitan ng Intel at EP2A40B724C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40B724C8 | EP2A40B724C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | APEX II | APEX II |
| Device Logic Elements / Cells | 38400 | — |
| Total System Gates | ~1.5 M | 1,500,000 |
| Total RAM Bits | 655360 | — |
| Number of I/O | 540 | — |
| Number of Logic Gates | [DATA_NEEDED: exact gate count in cells vs system gates] | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.425 V to 1.575 V (typ. 1.5 V) |
| Maximum Internal Frequency | 376 MHz | 562 MHz |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers | 0.15 µm CMOS, up to 8 metal layers, all-layer copper |
| I/O Standards Supported | True-LVDS, LVPECL, PCML, HyperTransport (up to 1 Gbps) | LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) |
| Packhaging / Kaso | 724-BBGA, FCBGA (35 x 35 mm) | — |
| Supplier Device Package | 724-BGA | — |
| Temperature na Operasyon | 0 °C to 85 °C (TJ) | 0 °C to +85 °C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Shipping Media | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status per datasheet] | Non-compliant (lead-bearing FCBGA) |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Logic Elements / Cells | — | 38,400 |
| Embedded RAM Bits | — | 655,360 |
| Maximum User I/O | — | 540 |
| PLLs | — | 4 |
| Packhaging | — | 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm |
| Configuration Method | — | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices |
| MultiVolt I/O Support | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| DDR Memory Support | — | Yes (via ESB / I/O circuitry) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |