EP2A40B724C8 vs EP2A40B724C7 比較
詳細並排比較 EP2A40B724C8 由 Intel 與 EP2A40B724C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2A40B724C8 | EP2A40B724C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | Obsolete |
| Family | APEX II | APEX II |
| Device Logic Elements / Cells | 38400 | — |
| Total System Gates | ~1.5 M | 1,500,000 |
| Total RAM Bits | 655360 | — |
| Number of I/O | 540 | — |
| Number of Logic Gates | [DATA_NEEDED: exact gate count in cells vs system gates] | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.425 V to 1.575 V (typ. 1.5 V) |
| Maximum Internal Frequency | 376 MHz | 562 MHz |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers | 0.15 µm CMOS, up to 8 metal layers, all-layer copper |
| I/O Standards Supported | True-LVDS, LVPECL, PCML, HyperTransport (up to 1 Gbps) | LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) |
| 封裝 / 外殼 | 724-BBGA, FCBGA (35 x 35 mm) | — |
| Supplier Device Package | 724-BGA | — |
| 工作溫度 | 0 °C to 85 °C (TJ) | 0 °C to +85 °C (commercial) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Shipping Media | Tray | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status per datasheet] | Non-compliant (lead-bearing FCBGA) |
| 濕度敏感等級 (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Logic Elements / Cells | — | 38,400 |
| Embedded RAM Bits | — | 655,360 |
| Maximum User I/O | — | 540 |
| PLLs | — | 4 |
| 封裝 | — | 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm |
| Configuration Method | — | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices |
| MultiVolt I/O Support | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| DDR Memory Support | — | Yes (via ESB / I/O circuitry) |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |