EP2A40F1020C8 vs EP2A40F1020C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F1020C8 sa pamamagitan ng Intel at EP2A40F1020C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40F1020C8 | EP2A40F1020C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX II | — |
| Logic Family | CMOS | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| System Gates | 1,500,000 | — |
| Logic Cells | 38,400 | 38,400 |
| Macros / Macro Cells | 2,560 | — |
| Embedded RAM | [DATA_NEEDED: total ESB bits] | — |
| Maximum Internal Frequency | 376 MHz | — |
| Propagation Delay | 1.55 ns | — |
| User I/O Pins | 735 | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | MultiVolt 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Package Type | FC-FBGA (FineLine BGA) | FC-FBGA, BGA-1020 |
| Package Pin Count | 1020 | — |
| Package Dimensions | 33 x 33 mm | — |
| Ball Pitch | 1.0 mm | 1 mm |
| Temperature na Operasyon | 0 C to +85 C (commercial, 'C' suffix) | 0 °C to 85 °C |
| Tindminan RoHS | [DATA_NEEDED: confirm per lot] | unknown |
| Configuration Interface | JTAG / Altera serial | — |
| Design Toolchain | Quartus II (legacy version 4.x or earlier recommended) | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Body Size | — | 33 mm x 33 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Uri ng Pagpapasok | — | Surface Mount |
| Terminal Form | — | Ball |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |