EP2A40F33C-9 vs EP2A40F33C-8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F33C-9 sa pamamagitan ng Intel at EP2A40F33C-8 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40F33C-9 | EP2A40F33C-8 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX II | APEX II |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | [DATA_NEEDED: embedded RAM bits] |
| Packhaging | 672-ball FineLine BGA (F33), 1.27 mm pitch | FBGA-672 (F33) |
| Speed Grade | -9 | -8 (slowest tier) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (Commercial, 'C' suffix) |
| Process Technology | 0.15 micrometer CMOS | — |
| PLLs | 4 | — |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | 40,000 |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | — |
| Level ng MSL | 3 | — |
| Peak Reflow Temperature | 220 C | 220 C |
| Tindminan RoHS | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS compliance status] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Maximum Gates | — | [DATA_NEEDED: maximum gate count] |
| Bilang ng Pin | — | 672 |
| Substrate Size | — | 33 mm |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | 3 |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Family Prefix | — | EP2A (APEX II series) |
| Device Class | — | FPGA / Programmable Logic Device |