EP2AGX260FF35C5G vs EP2AGZ300FF35C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260FF35C5G sa pamamagitan ng Intel at EP2AGZ300FF35C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX260FF35C5G | EP2AGZ300FF35C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Arria II GX | Arria II GZ |
| Family | Arria II GX (EP2AGX260) | — |
| Logic Elements | 244,188 | 300,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 119,088 |
| Embedded Memory (bits) | 12,038,144 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes |
| Maximum User I/O | 612 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Packhaging | 1152-ball FCBGA (FF35) | FCBGA-1152 (35 mm) |
| Package Code | BBGA / HBGA | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Speed Grade | C5 (mid-speed) | 3 (mid-performance) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0 C to 85 C junction) |
| Volte ng Pagbibigay | [DATA_NEEDED: core/rail voltages] | — |
| Lead-Free / RoHS | RoHS compliant (G suffix) | — |
| Process Node | 40 nm | — |
| Embedded Memory | — | 17,133 Kbit |
| Transceivers | — | 16 channels, up to 6.375 Gbps |
| Hard PCIe Controllers | — | Up to 12 (Gen2 endpoint/root-port) |
| User I/Os | — | 1,288 |
| I/O Banks | — | 12 |
| Process Technology | — | 40 nm TSMC |
| Package Family | — | BGA (Flip-Chip) |
| Configuration Method | — | Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel |
| Hard Memory Controller | — | DDR3 up to 800 MHz, DDR2, QDR II+ |
| Tindminan RoHS | — | Compliant |