EP2AGX45DF25I5G vs EP2AGX45DF25I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF25I5G sa pamamagitan ng Intel at EP2AGX45DF25I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF25I5G | EP2AGX45DF25I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 42,959 | 42,959 |
| User I/O Count | 252 | — |
| Packhaging | 572-FBGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch) | 572-ball FCBGA (HBGA) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Maximum Fabric Frequency | 500 MHz | — |
| Transceivers | Up to 3.125 Gbps | — |
| Embedded Memory | 2.7 Mbits | — |
| Embedded 18×18 Multipliers | 156 | — |
| PCIe Hard IP | PCI Express Gen1 (×1, ×4, ×8) | — |
| Speed Grade | I5 | I3 |
| Temperature na Operasyon | -40 °C to +100 °C (industrial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 |
| Tindminan RoHS | Compliant (Pb-free) | Compliant |
| Adaptive Logic Modules (ALM) | — | 17,715 |
| Embedded Memory Bits | — | 3,517,440 bits |
| Embedded Memory M9K Blocks | — | [DATA_NEEDED: M9K block count] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Maximum User I/O Pins | — | 252 |
| Transceiver Channels | — | [DATA_NEEDED: MGT channel count] |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Package Dimensions | — | 25 mm x 25 mm |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Process Node | — | 40 nm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT] |
| Hard IP for PCIe | — | PCIe Gen1/Gen2 endpoints and root ports |
| Lead-Free | — | Yes |