EP2AGX45DF29C4N vs EP2AGX45DF29C5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29C4N sa pamamagitan ng Intel at EP2AGX45DF29C5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX45DF29C4N - Arria II GX FPGA, 42K LE, 3.5Mb, 780-FBGA | Intel
EP2AGX45DF29C4N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29C4N | EP2AGX45DF29C5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | 42,959 |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | C5 |
| Temperature Range | 0C to +85C (commercial) | — |
| Packhaging | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FC-FBGA (29 mm x 29 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| Transceiver Channels | — | 8 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Voltage (typ.) | — | 0.9 V |
| Temperature ng Junction na Operasyon | — | 0°C to 85°C (Commercial) |
| Lead Finish | — | Pb-free (G suffix) |
| Configuration Memory | — | SRAM-based (volatile) |
| Process Node | — | 40 nm TSMC low-power |
| Hard Memory Controllers | — | DDR3 / DDR2 / QDR II+ / QDR II |
| PCI Express Hard IP | — | Gen1/Gen2 (PIPE) |
| DSP 18x18 Multipliers | — | Up to 156 |
| PLLs | — | On-die (multiple) |