EP2AGX45DF29C4N vs EP2AGX45DF29C5G 比較
詳細並排比較 EP2AGX45DF29C4N 由 Intel 與 EP2AGX45DF29C5G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGX45DF29C4N | EP2AGX45DF29C5G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | 42,959 |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | C5 |
| Temperature Range | 0C to +85C (commercial) | — |
| 封裝 | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FC-FBGA (29 mm x 29 mm) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| MSL 等級 | 3 | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| Transceiver Channels | — | 8 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Voltage (typ.) | — | 0.9 V |
| 工作接面溫度 | — | 0°C to 85°C (Commercial) |
| Lead Finish | — | Pb-free (G suffix) |
| Configuration Memory | — | SRAM-based (volatile) |
| Process Node | — | 40 nm TSMC low-power |
| Hard Memory Controllers | — | DDR3 / DDR2 / QDR II+ / QDR II |
| PCI Express Hard IP | — | Gen1/Gen2 (PIPE) |
| DSP 18x18 Multipliers | — | Up to 156 |
| PLLs | — | On-die (multiple) |