EP2AGX65DF29I5G vs EP2AGX65DF29I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF29I5G sa pamamagitan ng Intel at EP2AGX65DF29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX65DF29I5G | EP2AGX65DF29I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Intel FPGA (formerly Altera Arria II GX) |
| Logic Elements (LE) | 60,214 | 60214 |
| Embedded Memory | 5,371,904 bits | — |
| Logic Array Blocks (LABs) | 2,530 | — |
| User I/O Count | 364 | 364 |
| DSP Blocks | 17 (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 8 channels up to 6.3125 Gbps | — |
| Hard PCIe Controllers | 2 (Gen1/Gen2, endpoint + root port) | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage | 0.9 V | 0.9 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVDS, LVTTL, LVCMOS) | — |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA), 29 mm x 29 mm | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40 C to +100 C (Industrial) |
| Configuration Modes | FPP, AS, JTAG, PS | — |
| Security | AES-256 bitstream encryption | — |
| Tindminan RoHS | Compliant | Compliant (Pb-free N suffix) |
| Process Node | — | 40 nm TSMC low-power |
| Number of LABs/CLBs | — | 2530 |
| Embedded Memory (bits) | — | 5371904 |
| Total RAM Bits | — | 5,371,904 |
| Operating Frequency (max) | — | 500 MHz |
| Speed Grade | — | -3 |
| Transceivers | — | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| Configuration Method | — | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |