EP2AGX95DF25C6N vs EP2AGX95DF25I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX95DF25C6N sa pamamagitan ng Intel at EP2AGX95DF25I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX95DF25C6N | EP2AGX95DF25I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 89,178 | — |
| Logic Array Blocks (LAB) | 3,747 | — |
| Embedded Memory Bits | 6,839,296 | 6,839,296 |
| Maximum User I/Os | 260 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Packhaging | 572-ball FCBGA (Flip-Chip BGA) | 572-ball FCBGA |
| Maximum Operating Frequency | 400 MHz | — |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 6 | I3 |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | Serial/Parallel via Altera Quartus II |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Logic Elements | — | 89,178 |
| User I/O Count | — | 260 |
| Temperature Grade | — | Industrial |
| Temperature na Operasyon | — | -40C to +100C |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count per speed grade] |
| Maximum User I/O Voltage | — | [DATA_NEEDED: I/O bank supply range] |