EP2AGZ300FF35I3G vs EP2AGZ300FF35C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35I3G sa pamamagitan ng Intel at EP2AGZ300FF35C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ300FF35I3G EP2AGZ300FF35C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ —
Logic Elements (LE) 300000 —
Number of User I/O 554 (maximum) —
Number of Transceivers 8 —
Transceiver Data Rate Up to 6.375 Gbps —
Process Node 40 nm —
Temperature na Operasyon -40C to +100 C (I3 industrial) —
Packhaging 1152-ball FBGA (FF35) FCBGA-1152 (35 mm)
Uri ng Pagpapasok Surface Mount —
Volte ng Pagbibigay [DATA_NEEDED: core and I/O supply voltage values] —
Embedded Memory (Mbits) 16.4 —
DSP Blocks [DATA_NEEDED: number of DSP blocks] 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
PLLs [DATA_NEEDED: number of PLLs] —
Memory Interfaces DDR3, QDRII+, RLDRAM II —
Configuration Method Serial, Parallel, JTAG Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
Tindminan RoHS Compliant Compliant
Level ng MSL 3 (168 hours) —
Lead-Free Yes —
Series — Arria II GZ
Logic Elements — 300,000
Adaptive Logic Modules (ALMs) — 119,088
Embedded Memory — 17,133 Kbit
Transceivers — 16 channels, up to 6.375 Gbps
Hard PCIe Controllers — Up to 12 (Gen2 endpoint/root-port)
User I/Os — 1,288
I/O Banks — 12
Process Technology — 40 nm TSMC
Package Family — BGA (Flip-Chip)
Temperature Grade — Commercial (0 C to 85 C junction)
Speed Grade — 3 (mid-performance)
Hard Memory Controller — DDR3 up to 800 MHz, DDR2, QDR II+

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