EP2AGZ300FF35I3G vs EP2AGZ300FF35I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35I3G sa pamamagitan ng Intel at EP2AGZ300FF35I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FF35I3G | EP2AGZ300FF35I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300000 | — |
| Number of User I/O | 554 (maximum) | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Process Node | 40 nm | — |
| Temperature na Operasyon | -40C to +100 C (I3 industrial) | — |
| Packhaging | 1152-ball FBGA (FF35) | 1152-ball FC-FBGA (FF35) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (flip-chip BGA) |
| Volte ng Pagbibigay | [DATA_NEEDED: core and I/O supply voltage values] | — |
| Embedded Memory (Mbits) | 16.4 | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | Hard DSP columns (variable precision) |
| PLLs | [DATA_NEEDED: number of PLLs] | — |
| Memory Interfaces | DDR3, QDRII+, RLDRAM II | — |
| Configuration Method | Serial, Parallel, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | — | 11,920 |
| Maximum User I/O | — | 554 |
| Operating Frequency (Max) | — | 500 MHz |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | — | 1152 |
| Terminal Form | — | Ball (BGA) |
| Transceivers | — | 12.5 Gbps integrated |
| Embedded Memory | — | M20K blocks (distributed) |
| PCIe Support | — | PCIe Gen2 hard IP |