EP2AGZ300FF35I4G vs EP2AGZ300FF35C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35I4G sa pamamagitan ng Intel at EP2AGZ300FF35C4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FF35I4G | EP2AGZ300FF35C4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Series | Arria II GZ | Arria II GZ |
| Family Name | Arria II GZ FPGA | — |
| Logic Elements (LE) | 300,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 18.16 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: number of DSP blocks] |
| Maximum User I/O | 554 | — |
| Transceivers | Up to 21 channels | Multi-gigabit transceivers integrated |
| Transceiver Data Rate | 8.55 Gbps | — |
| Hard PCIe Controllers | PCIe Gen1 and Gen2 | — |
| Memory Interfaces | DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz | — |
| PLLs | Fractional PLLs on-chip | [DATA_NEEDED: PLL count] |
| Packhaging | 1152-FBGA (FF35) 35x35 mm | — |
| Temperature na Operasyon | -40C to +100C (Industrial, I4 grade) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | Compliant (per Besenchips / DigiKey listing) |
| Process Node | 40 nm | — |
| Speed Grade | 4 | — |
| Logic Elements | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (bits) | — | 18,854,912 (~17.9 Mbit) |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Operating Temperature Grade | — | Commercial (C4 = 0C to +85C) |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |