EP2AGZ300FH29C4N vs EP2AGZ300FF35C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29C4N sa pamamagitan ng Intel at EP2AGZ300FF35C4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29C4N | EP2AGZ300FF35C4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | 11,920 |
| Adaptive Logic Modules (ALMs) | 119,200 | — |
| Embedded Memory (bits) | 18,854,912 | 18,854,912 (~17.9 Mbit) |
| User I/O Pins | 281 | — |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | [DATA_NEEDED: number of DSP blocks] |
| Transceivers | Up to 28 (up to 6.375 Gbps) | Multi-gigabit transceivers integrated |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Packhaging | 780-ball FC-HFBGA (FH29) | — |
| Speed Grade | C4 | — |
| Temperature Grade | Industrial (N suffix) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant (per Besenchips / DigiKey listing) |
| Series | — | Arria II GZ |
| Logic Elements | — | 298,000 |
| User I/O Count | — | 554 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Process Technology | — | 40 nm |
| Package Type | — | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | — | Ball |
| Package Code (JEDEC) | — | HBGA |
| Operating Temperature Grade | — | Commercial (C4 = 0C to +85C) |
| Configuration Memory | — | SRAM-based (volatile, requires boot device) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Lead-Free Status | — | Lead free (per Besenchips listing) |
| Maximum Operating Frequency | — | 500 MHz |