EP2AGZ300HF40C3G vs EP2AGZ300HF40I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300HF40C3G sa pamamagitan ng Intel at EP2AGZ300HF40I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300HF40C3G | EP2AGZ300HF40I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | 298,000 |
| User I/O Count | 734 | 734 |
| Packhaging | 1517-ball FBGA | 1517-BBGA, FCBGA (HF40) |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Temperature na Operasyon | Commercial (0C to +85C) | — |
| Embedded Memory | Approx. 18.7 Mbits | — |
| DSP Blocks | 800+ (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| Tindminan RoHS | Pb-free finish - compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Family | — | EP2AGZ |
| Embedded Memory Bits | — | 18,854,912 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 0.9 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Number of PLLs | — | 4 |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | AES-256 |