EP2AGZ350FH29C3N vs EP2AGZ225FF35I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FH29C3N sa pamamagitan ng Intel at EP2AGZ225FF35I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FH29C3N | EP2AGZ225FF35I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | 224,000 |
| Embedded Memory (bits) | 21,270,528 | — |
| Number of LABs/CLBs | 13,940 | — |
| User I/O Count | 281 | 554 |
| Packhaging | 780-BBGA, FCBGA (FH29) | 1152-ball FC-FBGA |
| Number of Pins / Terminals | 780 | — |
| Speed Grade | C3 | — |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Voltage - Supply | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead free | — |
| Process Node | 40 nm | — |
| Embedded Memory | — | 14,248,960 bits (approx. 14.25 Mbit) |
| Logic Array Blocks (LABs) | — | 8,960 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | 24 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Configuration Method | — | SRAM-based (volatile, requires external config device) |
| Maximum User I/O | — | 554 |