EP2AGZ350FH29C3N vs EP2AGZ350FH29C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FH29C3N sa pamamagitan ng Intel at EP2AGZ350FH29C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FH29C3N | EP2AGZ350FH29C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | — |
| Series | Arria II GZ | — |
| Logic Elements (LE) | 348,500 | — |
| Embedded Memory (bits) | 21,270,528 | — |
| Number of LABs/CLBs | 13,940 | — |
| User I/O Count | 281 | — |
| Packhaging | 780-BBGA, FCBGA (FH29) | 780-ball FBGA (HBGA, 29x29 mm) |
| Number of Pins / Terminals | 780 | — |
| Speed Grade | C3 | C3 (commercial, slowest) |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Voltage - Supply | [DATA_NEEDED: core VCC, VCCAUX, VCCD_PLL values] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Process Node | 40 nm | 40 nm TSMC |
| Logic Elements | — | 350,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Bits) | — | 16,402,944 |
| Embedded Memory Blocks | — | [DATA_NEEDED: M9K/M144K block count] |
| User I/O Pins | — | 281 |
| Transceivers | — | 24 channels |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| PCI Express Hard IP | — | 4 x PCIe Gen2 (x1/x4) |
| External Memory Interface | — | DDR3 up to 800 MHz, DDR2, QDRII+ |
| PLLs | — | 8 (4 enhanced, 4 fast) |
| Global Clocks | — | 16 |
| Temperature ng Junction na Operasyon | — | 0C to +85C |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |