EP2C70F896C7K vs EP2C70F896C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C70F896C7K sa pamamagitan ng Intel at EP2C70F896C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2C70F896C8 - Cyclone II FPGA 68K LE 622 I/O 896-FBGA | Intel / Altera
EP2C70F896C8 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2C70F896C7K | EP2C70F896C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | — |
| Embedded Memory (M4K blocks) | 4,488 Kbits | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O Pins | 622 | — |
| Maximum User I/O (this package) | [DATA_NEEDED: per F896 pinout] | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 16 | — |
| Process Technology | 90 nm low-power CMOS | 90 nm CMOS SRAM |
| Core Voltage | 1.2 V | — |
| Operating Temperature Grade | Commercial (0C to 85C) | — |
| Packhaging | 896-ball FineLine BGA (F896) | 896-ball FineLine BGA (FBGA-896) |
| Speed Grade | 7 | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 68,416 |
| Total Memory Bits | — | 1,152,000 |
| Number of I/Os | — | 622 |
| Number of LABs/CLBs | — | 4536 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Count | — | 8 banks |
| Package Dimensions | — | 31 x 31 mm |
| Embedded Multipliers | — | 150 (18 x 18) |
| PLLs | — | 4 |
| Maximum User I/O | — | 622 |
| Configuration Method | — | Active Serial / Passive Serial / JTAG |
| Temperature na Operasyon | — | Commercial (0C to +85C) |