EP2S130F1020C3NGA vs EP2S130F1020I4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1020C3NGA sa pamamagitan ng Intel at EP2S130F1020I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2S130F1020C3NGA EP2S130F1020I4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family Stratix II Stratix II
Logic Elements (LE) 132,540 —
Logic Array Blocks (LABs) 6,627 —
Embedded Memory (TriMatrix) 6,747,840 bits (6.7 Mbits) —
Embedded DSP Blocks Yes (18x18 multiplier blocks) —
User I/Os 742 —
Process Technology 90 nm —
Core Voltage 1.2 V —
Maximum Internal Clock Frequency 778.82 MHz —
Packhaging 1020-ball FC-FBGA 1020-ball FC-FBGA (33x33 mm)
Speed Grade C3 I (industrial performance)
Temperature Grade Commercial (0C to +85C) —
PLLs 12 (8 fast PLLs + 4 enhanced PLLs) —
Configuration Modes PS, PPS, PPA, JTAG —
Configuration Encryption 128-bit AES —
Tindminan RoHS [DATA_NEEDED: rohs status] Compliant (per distributor listings)
On-chip Termination (OCT) Yes (series, parallel, dynamic) —
Logic Elements — 132,540
Equivalent LEs — ~180,000
Adaptive Logic Modules (ALMs) — 53,016
Embedded Memory (bits) — 6,747,840
Embedded Memory (M512 blocks) — 530
Embedded Memory (M4K blocks) — 768
Embedded Memory (M-RAM blocks) — 4
Embedded 18x18 Multipliers — 504
DSP Blocks — 48
User I/O Pins — 742
User I/O Banks — 12
Process Node — 90 nm CMOS, all-layer copper
Core Voltage (VCCINT) — 1.2 V
Device Revision — 4
Temperature ng Junction na Operasyon — -40C to +100C (industrial)
Configuration Scheme — Fast Passive Parallel x8, Passive Serial, JTAG
Uri ng Pagpapasok — Surface Mount (FC-FBGA)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita