EP2S180F1020I4 vs EP2S60F1020I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S180F1020I4 sa pamamagitan ng Intel at EP2S60F1020I4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S180F1020I4 | EP2S60F1020I4 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | Stratix II | Stratix II |
| Family | Stratix II (EP2S180) | — |
| Logic Elements | 179,400 | — |
| Number of LABs/CLBs | 8,970 | 3022 |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | — |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | 12 |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Maximum Operating Frequency | 711.24 MHz | — |
| Temperature na Operasyon | -40C to +100C (Industrial grade, "I4" suffix) | — |
| Packhaging | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| Tindminan RoHS | Compliant | Non-compliant (contains lead per legacy Altera package) |
| Lead-Free | Yes | — |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | Passive Serial / Fast Passive Parallel / JTAG |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | — |
| Base Part Number | EP2S180 | — |
| Manufacturer | — | Intel / Altera |
| Logic Elements (LEs) | — | 60,440 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 24176 |
| Maximum User I/O | — | 718 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Operating Voltage (Core) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C TJ) |
| Package Type | — | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Global Clock Networks | — | 16 |
| Embedded Multipliers (18x18) | — | 36 |
| Transceiver Count | — | 0 (no embedded transceivers) |
| Maximum Embedded Memory Bandwidth | — | [DATA_NEEDED: memory bandwidth spec] |