EP2S180F1020I4 vs EP2S60F1020I4 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2S180F1020I4 tarafından Intel ve EP2S60F1020I4 tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP2S180F1020I4 | EP2S60F1020I4 |
|---|---|---|
| Marka | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Obsolete | NRND |
| Series | Stratix II | Stratix II |
| Family | Stratix II (EP2S180) | — |
| Logic Elements | 179,400 | — |
| Number of LABs/CLBs | 8,970 | 3022 |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | — |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | 12 |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Maximum Operating Frequency | 711.24 MHz | — |
| İşletim Sıcaklığı | -40C to +100C (Industrial grade, "I4" suffix) | — |
| Paket | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| MSL Seviyesi | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| RoHS Durumu | Compliant | Non-compliant (contains lead per legacy Altera package) |
| Lead-Free | Yes | — |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | Passive Serial / Fast Passive Parallel / JTAG |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | — |
| Base Part Number | EP2S180 | — |
| Manufacturer | — | Intel / Altera |
| Logic Elements (LEs) | — | 60,440 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 24176 |
| Maximum User I/O | — | 718 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Operating Voltage (Core) | — | 1.2 V |
| Temperature Grade | — | Industrial (-40C to +100C TJ) |
| Package Type | — | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Global Clock Networks | — | 16 |
| Embedded Multipliers (18x18) | — | 36 |
| Transceiver Count | — | 0 (no embedded transceivers) |
| Maximum Embedded Memory Bandwidth | — | [DATA_NEEDED: memory bandwidth spec] |