EP2S180F1508C5 vs EP2S180F1508C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S180F1508C5 sa pamamagitan ng Altera at EP2S180F1508C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera
EP2S180F1508C5 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2S180F1508C5 | EP2S180F1508C4 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Stratix II | — |
| Series | EP2S180 | Stratix II |
| Logic Elements | 179,400 | — |
| Equivalent LEs | ~179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Adaptive Logic Modules (ALMs) | 71,760 | — |
| Total RAM Bits | 9,383,040 | 9,383,040 bits |
| Embedded Memory | M512 / M4K / M-RAM blocks | — |
| DSP Blocks | 96 | — |
| User I/O Pins | 1,170 | — |
| Maximum User I/O | 1,170 | — |
| Process Technology | 90 nm, all-layer copper, SRAM | 90 nm |
| Core Voltage | 1.15 V to 1.25 V | — |
| Packhaging | 1508-FBGA (FCBGA), 40 mm × 40 mm | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial, C5 speed grade) | [DATA_NEEDED: operating temperature range] |
| Speed Grade | C5 | — |
| Configuration | SRAM, JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements/Cells | — | 179,400 cells |
| Number of I/O | — | 1,170 I/O |
| Volte ng Pagbibigay | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Packhaging / Kaso | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |