EP2S30F484C5N vs EP2S30F484I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S30F484C5N sa pamamagitan ng Intel at EP2S30F484I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S30F484C5N | EP2S30F484I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 33880 | 33,880 |
| Adaptive Logic Modules (ALMs) | 13552 | — |
| Logic Array Blocks (LABs) | 1694 | — |
| Maximum User I/O Pins | 342 | — |
| Embedded RAM Bits | 1369728 | — |
| DSP Blocks | 24 | — |
| Embedded 18x18 Multipliers | 24 | — |
| PLLs | 12 | Yes (on-chip, refer to datasheet for count) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | C5 | 4 |
| Maximum Internal Frequency | 609.76 MHz | — |
| Packhaging | 484-Ball FBGA (FBGA-484) | 484-ball FineLine BGA (FBGA) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | — |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.2 V (refer to datasheet) |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| Configuration Method | — | Serial/parallel via Quartus II |