EP2SGX30CF780C3 vs EP2SGX30CF780I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C3 sa pamamagitan ng Intel at EP2SGX30CF780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX30CF780C3 EP2SGX30CF780I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Array Blocks (LABs) 1,694 33,880
Embedded RAM Bits 1,369,728 —
User I/Os 361 —
Packhaging 780-ball FineLine BGA 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch)
Process Node 90 nm —
Speed Grade -3 —
Temperature na Operasyon 0C to +85C (commercial) -40 °C to +85 °C (Industrial)
Transceivers Embedded (GX family, up to 3.125 Gbps per channel) Embedded multi-gigabit transceivers (6.375 Gbps)
Memory Interfaces DDR / DDR2 / QDRII PHY —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status not confirmed in supplied data]
Lead-Free Yes —
Wala sa Halogen [DATA_NEEDED: halogen-free status] —
Logic Cells — 33,880
Maximum Internal Frequency — 622.08 MHz
Number of User I/O Pins — 361
Process Technology — 90 nm CMOS
Core Voltage — 1.2 V
Terminal Pitch — 1.0 mm
Temperature Grade Suffix — I3 (Industrial)
Total Terminals — 780
Package Code — BGA, square shape

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