EP2SGX30CF780C3 vs EP2SGX30CF780I3 比較

詳細並排比較 EP2SGX30CF780C3 由 Intel 與 EP2SGX30CF780I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ 最後購買機會

規格比較

參數 EP2SGX30CF780C3 EP2SGX30CF780I3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 最後購買
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Array Blocks (LABs) 1,694 33,880
Embedded RAM Bits 1,369,728 —
User I/Os 361 —
封裝 780-ball FineLine BGA 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch)
Process Node 90 nm —
Speed Grade -3 —
工作溫度 0C to +85C (commercial) -40 °C to +85 °C (Industrial)
Transceivers Embedded (GX family, up to 3.125 Gbps per channel) Embedded multi-gigabit transceivers (6.375 Gbps)
Memory Interfaces DDR / DDR2 / QDRII PHY —
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status not confirmed in supplied data]
Lead-Free Yes —
無鹵素 [DATA_NEEDED: halogen-free status] —
Logic Cells — 33,880
Maximum Internal Frequency — 622.08 MHz
Number of User I/O Pins — 361
Process Technology — 90 nm CMOS
Core Voltage — 1.2 V
Terminal Pitch — 1.0 mm
Temperature Grade Suffix — I3 (Industrial)
Total Terminals — 780
Package Code — BGA, square shape

資料表與資源

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