EP2SGX30CF780C7 vs EP2SGX30CF780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C7 sa pamamagitan ng Intel at EP2SGX30CF780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX30CF780C7 | EP2SGX30CF780C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Series | Stratix II GX | — |
| Logic Elements | 33,000 | 33,880 |
| Embedded Memory | 1.9 Mbits | — |
| DSP Blocks (18x18 multipliers) | 256 | — |
| Maximum User I/O | 361 | — |
| Multi-Gigabit Transceivers | 4 channels | — |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps | — |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | — |
| Packhaging | 780-ball FineLine BGA (CF780) | 780-ball FineLine BGA |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | C7 (fastest commercial) | -3 |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG | — |
| Tindminan RoHS | Compliant (lead-free Fineline BGA) | Compliant |
| Family | — | Stratix II GX |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Transceivers | — | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Lead-Free | — | Yes |
| Wala sa Halogen | — | [DATA_NEEDED: halogen-free status] |