EP2SGX60DF780C4N vs EP2SGX60DF780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C4N sa pamamagitan ng Intel at EP2SGX60DF780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N Obsolete
Pagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C4N | EP2SGX60DF780C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| User I/Os | 364 | — |
| Total RAM Bits | 2,544,192 | [DATA_NEEDED: total embedded memory bits] |
| Embedded Multipliers (18x18) | 144 | — |
| DSP Blocks | 36 | — |
| Transceivers | Up to 20 (up to 6.375 Gbps) | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Node | 90 nm CMOS | — |
| Packhaging | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Maximum Internal Frequency | 717 MHz | — |
| Temperature na Operasyon | Commercial 0C to +85C | — |
| Speed Grade | C4 | C3 (fastest commercial) |
| Tindminan RoHS | Lead-free (per part suffix N) | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Technology | — | 90 nm |
| Internal Frequency (max) | — | ~717 MHz |
| Uri ng Pagpapasok | — | Surface Mount |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |