EP2SGX60EF1152C3N vs EP2SGX60E1152C Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152C3N sa pamamagitan ng Intel at EP2SGX60E1152C sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152C3N | EP2SGX60E1152C |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements | 60,440 | 60440 |
| Adaptive Logic Modules (ALMs) | 30,220 | — |
| Logic Array Blocks (LABs) | 3022 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | 600 Mbps to 6.375 Gbps |
| Packhaging | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1152-ball FineLine BGA |
| Speed Grade | C3 (commercial, -3 bin) | C (commercial, fastest) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| On-chip RAM (bits) | — | 2544192 |
| DSP / Embedded Multiplier Blocks | — | 144 (18x18 multipliers) |
| Maximum User I/O | — | 534 |
| Process Node | — | 90 nm |
| Multi-gigabit Transceivers | — | 20 channels |
| PCI Express Hard IP | — | x1, x4, x8 endpoints and root ports |
| Embedded Memory Type | — | TriMatrix (MLAB + M512 + M4K) |
| Configuration | — | Active serial / Fast passive parallel / JTAG |
| Tindminan RoHS | — | Compliant |