EP2SGX90EF1152C4N vs EP2SGX90EF1152C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90EF1152C4N sa pamamagitan ng Intel at EP2SGX90EF1152C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
EP2SGX90EF1152C4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX90EF1152C4N | EP2SGX90EF1152C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix II GX | — |
| Logic Elements (LE) | 90,960 | — |
| LABs/CLBs | 4,548 | — |
| Total RAM Bits | 4,520,448 bits | 4,520,448 (4.5 Mbit) |
| User I/O Count | 558 | 558 |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 1.2 V | — |
| Process Node | 90 nm | — |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel | — |
| Speed Grade | C4 | C3 |
| Temperature na Operasyon | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Packhaging | 1152-BBGA / FC-FBGA-1152 | 1152-FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | MSL-3 / MS-034AAR-1 (per package outline) | — |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC | — |
| Series | — | Stratix II GX |
| Logic Elements (LEs) | — | 90,960 |
| Number of LABs/CLBs | — | 4548 |
| Number of Transceivers | — | 12 |
| Transceiver Data Rate | — | 3.125 - 6.375 Gbps |
| Number of PLLs | — | 4 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 90 nm CMOS |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |