EP3C10F256C6 vs EP3C10E144C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C10F256C6 sa pamamagitan ng Intel at EP3C10E144C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C10F256C6 | EP3C10E144C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone® III |
| Logic Elements (LE) | 10,320 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | 94 |
| Packhaging | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 144-pin LQFP Exposed Pad (EQFP-144) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Process Technology | 60 nm low-power CMOS | TSMC 65 nm low-power CMOS |
| Configuration Memory | SRAM-based (external EPCS flash required) | — |
| Temperature na Operasyon | -40 C to +125 C (industrial, suffix 'C') | — |
| Speed Grade | 6 | — |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LEs) | — | 10,320 |
| Embedded Memory (M9K BRAM) | — | 414 Kbits |
| Maximum Internal Clock Frequency | — | 437.5 MHz |
| Configuration Modes | — | JTAG, Active Serial, Active Parallel |
| Temperature ng Junction na Operasyon | — | 0C to +85C (Commercial, C7 speed grade) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) |