EP3C120F780C7N vs EP3C40F780C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C120F780C7N sa pamamagitan ng Intel at EP3C40F780C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3C120F780C7N - 119K Logic Element Cyclone III FPGA | Intel / Altera
EP3C120F780C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3C120F780C7N | EP3C40F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone III | Cyclone III |
| Series | EP3C120 | — |
| Logic Elements (LE) | 119,088 | — |
| Total Memory Bits | 3,981,312 | — |
| Embedded Memory Blocks (M9K) | 432 | — |
| 18x18 Hardware Multipliers | 531 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 429 | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | C7 | 6 (commercial) |
| Process Technology | 65 nm low-k | 60 nm CMOS |
| Packhaging | 780-pin FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FBGA) |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Logic Elements | — | 39,600 |
| Embedded Memory Bits | — | 1,161,216 |
| Embedded Memory (Kbytes) | — | 113 |
| M9K Memory Blocks | — | 126 |
| Logic Array Blocks (LABs) | — | 4,065 |
| Maximum User I/O Pins | — | 535 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 2.6 mm |
| Lead Free | — | Yes |
| Configuration Method | — | SRAM, JTAG via USB-Blaster |
| Tindminan RoHS | — | Compliant |