EP3C16F256I7N vs EP3C5F256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C16F256I7N sa pamamagitan ng Intel at EP3C5F256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C16F256I7N | EP3C5F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | 5136 |
| Logic Array Blocks (LABs) | 963 | 182 (per DigiKey listing) |
| Total Memory Bits | 516096 | 423936 |
| Embedded Memory | 56 M9K blocks (504 Kbit) | — |
| Embedded 18x18 Multipliers | 56 | 23 |
| PLLs | 4 | 2 |
| Maximum User I/O Pins | 168 | — |
| Packhaging | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Temperature na Operasyon | -40C to +100C (industrial, I7) | 0 C to +85 C (commercial "C6" speed grade) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | — |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Series | — | EP3C5 |
| Maximum User I/Os | — | 182 |
| Core Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.2 V |
| Uri ng Pagpapasok | — | Surface Mount |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |
| Configuration Modes | — | Serial, Parallel, JTAG, AS, PS |