EP3C25F324C6N vs EP3C25F324C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C6N sa pamamagitan ng Intel at EP3C25F324C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C6N | EP3C25F324C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | — |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | 66 (18 x 18) |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | 4 |
| Packhaging | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Speed Grade | C6 (commercial) | 8 (commercial) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0 °C to +85 °C (commercial) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, SRAM-based |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Logic Elements | — | 24,624 LE |
| Logic Array Blocks | — | 1,539 LABs |
| Embedded Memory | — | 608,256 bits |
| User I/Os | — | 215 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock | — | 402 MHz |
| Tindminan RoHS | — | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |