EP3C40F780C7N vs EP3C40F780I8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780C7N sa pamamagitan ng Intel at EP3C40F780I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C40F780C7N EP3C40F780I8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone III Cyclone III
Logic Elements 39,600 LE —
Total RAM Bits 1,161,216 bits —
Embedded Multipliers 126 (18x18) —
User I/Os 535 —
Packhaging 780-ball FBGA (FineLine BGA) 780-ball FBGA (F780)
Speed Grade 7 (C7, commercial) —
Process Node 65 nm TSMC low-power —
Temperature na Operasyon 0C to +85C (commercial) —
Supply Voltage (Core) 1.2 V —
Configuration Method JTAG, Active Serial, Passive Serial —
PLLs 4 —
Global Clock Networks 20 —
Lead-Free / RoHS Yes (N suffix) —
Moisture Sensitivity Level MSL3 (per J-STD-020) —
Device Logic Elements — 39,600
Logic Array Blocks (LABs/CLBs) — 2,475
Embedded Memory (bits) — 1,161,216
Embedded Memory (Kbits) — 1,134
Embedded Multipliers (18x18) — 126
Number of PLLs — 4
User I/O Pins — 535
I/O Banks — 20
Nominal Core Supply Voltage — 1.2 V (1.15 V to 1.25 V)
Package Ball Pitch — 1.0 mm
Process Technology — TSMC 65 nm low-power CMOS
Operating Temperature Grade — Industrial (-40 °C to +100 °C junction)
Configuration Modes — Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel
Tindminan RoHS — Compliant
Level ng MSL — 3
Uri ng Pagpapasok — Surface Mount (BGA)

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