EP3C40F780C7N vs EP3C40F780I8N 比較

詳細並排比較 EP3C40F780C7N 由 Intel 與 EP3C40F780I8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C40F780C7N EP3C40F780I8N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III Cyclone III
Logic Elements 39,600 LE —
Total RAM Bits 1,161,216 bits —
Embedded Multipliers 126 (18x18) —
User I/Os 535 —
封裝 780-ball FBGA (FineLine BGA) 780-ball FBGA (F780)
Speed Grade 7 (C7, commercial) —
Process Node 65 nm TSMC low-power —
工作溫度 0C to +85C (commercial) —
Supply Voltage (Core) 1.2 V —
Configuration Method JTAG, Active Serial, Passive Serial —
PLLs 4 —
Global Clock Networks 20 —
Lead-Free / RoHS Yes (N suffix) —
Moisture Sensitivity Level MSL3 (per J-STD-020) —
Device Logic Elements — 39,600
Logic Array Blocks (LABs/CLBs) — 2,475
Embedded Memory (bits) — 1,161,216
Embedded Memory (Kbits) — 1,134
Embedded Multipliers (18x18) — 126
Number of PLLs — 4
User I/O Pins — 535
I/O Banks — 20
Nominal Core Supply Voltage — 1.2 V (1.15 V to 1.25 V)
Package Ball Pitch — 1.0 mm
Process Technology — TSMC 65 nm low-power CMOS
Operating Temperature Grade — Industrial (-40 °C to +100 °C junction)
Configuration Modes — Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel
RoHS 狀態 — Compliant
MSL 等級 — 3
安裝類型 — Surface Mount (BGA)

資料表與資源

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