EP3C40U484I7 vs EP3C40U484C7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40U484I7 sa pamamagitan ng Intel at EP3C40U484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C40U484I7 EP3C40U484C7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Cyclone® III Cyclone® III
Logic Elements (LEs) 39,600 —
Embedded Memory (RAM bits) 1,161,216 (113 x M9K) —
Embedded Multipliers (18x18) 56 126
User I/Os 331 (max) —
PLLs 4 —
Global Clock Networks 20 —
Packhaging 484-FBGA (UBGA, U484) —
Ball Pitch 1.0 mm —
Package Dimensions 19x19 mm —
Process Node 65 nm TSMC low-power —
Speed Grade 7 (fastest in U484) —
Temperature Grade Industrial (-40C to +100C Tj) —
Supply Voltage VCCINT 1.2 V (core) —
Supply Voltage VCCIO 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) —
Configuration Modes Active Serial, Active Parallel, Passive Serial, JTAG —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL 3 —
Tindminan RoHS Compliant Compliant
Family — Cyclone III (Low-Power FPGA)
Logic Elements — 39,600
Total RAM Bits — 1,161,216
Number of I/O — 331 (maximum user I/O)
Number of LABs/CLBs — 2,481
Number of Logic Elements/Cells — 39,600
Total Memory — 1161216 bit
Number of PLLs — 4
Supply Voltage - Core — 1.2 V
Temperature na Operasyon — 0C to +85C (commercial)
Packhaging / Kaso — 484-FBGA (UBGA, 19x19 mm)
Process Technology — 65 nm TSMC low-k
Configuration Method — SRAM (JTAG / Active Serial)
Lead-Free — Yes

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