EP3C55F484C8 vs EP3C55F484C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C8 sa pamamagitan ng Intel at EP3C55F484C8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C55F484C8 EP3C55F484C8N
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone® III Cyclone III
Logic Elements (LEs) 55,856 —
Logic Array Blocks (LABs) 3,491 —
Embedded Memory Bits 2,396,160 bits 2,396,160
Embedded 18x18 Multipliers 312 —
User I/Os 327 —
PLLs 4 4
Global Clock Networks 20 —
Maximum Core Frequency 472.5 MHz —
Process Technology 65 nm low-power CMOS —
Packhaging 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch
Speed Grade C8 (commercial, -8) —
Temperature na Operasyon Commercial (0C to +85C) —
Configuration Modes JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) —
Lead-Free / RoHS Yes (Pb-free FBGA) Yes - lead-free, RoHS compliant
Volte ng Pagbibigay Core 1.2 V typical, I/O bank dependent —
I/O Standards Supported LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others —
Logic Elements (LE) — 55,856
User I/O Pins — 327
Memory Blocks (M9K) — 260
Embedded Multipliers (18x18) — 260
Maximum Internal Frequency — 472 MHz
Core Voltage (VCCINT) — 1.2 V
Package Height — 2.60 mm
Operating Temperature (Commercial) — 0 C to +85 C
Process Node — 65 nm TSMC low-power
Configuration — SRAM-based, JTAG / AS / PS modes
Uri ng Pagpapasok — Surface Mount (BGA)

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