EP3C55F780C6N vs EP3C40F780C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C6N sa pamamagitan ng Intel at EP3C40F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C55F780C6N EP3C40F780C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Cyclone III Cyclone® III
Family Cyclone III FPGA Cyclone III
Logic Elements (LE) 55,856 39,600
Embedded Memory (bits) 2,396,160 —
Embedded Memory (Kb) 2,340 Kb —
Embedded 18x18 Multipliers 312 126 (up to 396 9x9)
Maximum User I/O 377 —
PLLs 4 —
Global Clocks 20 —
Process Technology 65 nm low-power CMOS 65nm TSMC low-power
Packhaging 780-ball FBGA (F780) 780-ball FBGA, 1.0mm pitch
Package Code BGA, 780 balls —
Speed Grade C6 8 (C8)
Temperature na Operasyon 0C to +85C (commercial) 0°C to +85°C (Commercial)
Tindminan RoHS Compliant Compliant
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Voltage - Supply (Core) 1.2 V (typical) —
Voltage - I/O Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) —
Total Memory Bits — 1,161,216 bits
Number of LABs/CLBs — 2,475
Embedded Memory Blocks — M9K x 126
Number of PLLs — 4
Maximum User I/Os — 535
Number of I/O Banks — 9
Core Voltage — 1.15V to 1.25V
Configuration Modes — AS, PS, FPP, JTAG

Mga Datasheets at Resources

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