EP3C55F780C8N vs EP3C55F780C6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C8N sa pamamagitan ng Intel at EP3C55F780C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C55F780C8N EP3C55F780C6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Cyclone III Cyclone III
Family Cyclone III (low-cost FPGA) —
Logic Elements (LE) 55,856 —
Logic Array Blocks (LAB) 3,491 —
Total RAM Bits 2,396,160 bits (2396 Kbit) —
Embedded Memory Blocks (M9K) 260 —
Embedded 18x18 Multipliers 156 —
PLLs 4 —
Maximum User I/O 377 —
User I/O Banks 4 —
Process Technology 65 nm TSMC low-power 65 nm low power
Core Supply Voltage 1.15 V to 1.25 V —
Packhaging 780-pin FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA
Speed Grade 8 (commercial, slowest) -6 (C6)
Temperature na Operasyon 0C to +85C (commercial, 'C' suffix) 0C to +85C (Commercial)
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG —
Internal Frequency (typ.) 402 MHz —
Tindminan RoHS Compliant (lead-free FBGA) Compliant
Logic Elements — 55,856
Embedded Memory Bits — 2,396,160
Number of Block RAM (M9K) — 260
18x18 Hardware Multipliers — 156
User I/Os — 377
Configuration Methods — JTAG, AS, AP, PS
Number of PLLs — 4
Maximum User I/O Voltage Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Uri ng Pagpapasok — Surface Mount (BGA)

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