EP3C55F780C8N vs EP3CLS100F780C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C8N sa pamamagitan ng Intel at EP3CLS100F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C55F780C8N EP3CLS100F780C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Cyclone III —
Family Cyclone III (low-cost FPGA) —
Logic Elements (LE) 55,856 100,448
Logic Array Blocks (LAB) 3,491 6,278
Total RAM Bits 2,396,160 bits (2396 Kbit) —
Embedded Memory Blocks (M9K) 260 —
Embedded 18x18 Multipliers 156 —
PLLs 4 —
Maximum User I/O 377 429
User I/O Banks 4 —
Process Technology 65 nm TSMC low-power 65 nm low-power CMOS
Core Supply Voltage 1.15 V to 1.25 V —
Packhaging 780-pin FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Speed Grade 8 (commercial, slowest) —
Temperature na Operasyon 0C to +85C (commercial, 'C' suffix) —
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG —
Internal Frequency (typ.) 402 MHz —
Tindminan RoHS Compliant (lead-free FBGA) Compliant
Device Family — Cyclone III LS
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Number of PLLs — 4
Core Supply Voltage (VCCINT) — 1.2 V
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Uri ng Pagpapasok — Surface Mount (BGA)
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita