EP3C55U484C7N vs EP3C55U484C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55U484C7N sa pamamagitan ng Intel at EP3C55U484C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55U484C7N | EP3C55U484C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) | — |
| Maximum User I/Os | 327 | — |
| I/O Banks | 8 | — |
| DSP Blocks (18 x 18 Multipliers) | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) | — |
| PLLs | 4 | — |
| M9K Memory Blocks | 260 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | 0C to +85C (Commercial) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Packhaging | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm | 484-ball UBGA (Ultra-FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,488 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Multipliers (18x18) | — | 156 |
| Maximum User I/O Pins | — | 327 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | 437 MHz |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltages | — | 1.2 V / 2.5 V / 3.0 V / 3.3 V |
| Package Dimensions | — | 19 x 19 mm |
| Ball Pitch | — | 0.80 mm |
| Speed Grade | — | C7 (Commercial) |