EP3C5F256I7N vs EP3C5F256C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256I7N sa pamamagitan ng Intel at EP3C5F256C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256I7N | EP3C5F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Packhaging | 256-FBGA (FineLine BGA) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Temperature na Operasyon | -40C to +125C (Industrial) | — |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | 65 nm CMOS, low-k |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | AS, PS, JTAG |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Tindminan RoHS | Compliant | Compliant (lead-free per FBGA package) |
| Level ng MSL | 3 (168 hours) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | — | 23 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |