EP3C5U256C8 vs EP3C5U256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5U256C8 sa pamamagitan ng Intel at EP3C5U256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
EP3C5U256C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3C5U256C8 | EP3C5U256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone® III | Cyclone III |
| Logic Elements | 5,136 | 5,136 |
| Total Memory Bits | 423,936 | — |
| Number of Logic Array Blocks (LABs) | 182 | — |
| Number of I/O Pins | 182 (maximum user I/O) | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 2 | — |
| Packhaging | 256-LFBGA (UBGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Code | LFBGA-256, 17x17 mm | — |
| Speed Grade | 8 (commercial) | C6 |
| Temperature na Operasyon | 0C to +85C (commercial grade) | — |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) | — |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | AS, PS, JTAG, Fast Passive Parallel |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead Free / RoHS | — | Yes / Compliant |