EP3C5U256C8 vs EP3C5U256C6N Perbandingan
Perbandingan bersamaan detil EP3C5U256C8 dari Intel dan EP3C5U256C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C5U256C8 | EP3C5U256C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone® III | Cyclone III |
| Logic Elements | 5,136 | 5,136 |
| Total Memory Bits | 423,936 | — |
| Number of Logic Array Blocks (LABs) | 182 | — |
| Number of I/O Pins | 182 (maximum user I/O) | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 2 | — |
| Paket | 256-LFBGA (UBGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Code | LFBGA-256, 17x17 mm | — |
| Speed Grade | 8 (commercial) | C6 |
| Suhu Kerja | 0C to +85C (commercial grade) | — |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) | — |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | AS, PS, JTAG, Fast Passive Parallel |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lead Free / RoHS | — | Yes / Compliant |