EP3CLS150F780C7N vs EP3CLS100F780C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS150F780C7N sa pamamagitan ng Intel at EP3CLS100F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3CLS150F780C7N EP3CLS100F780C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone III LS Cyclone III LS
Logic Elements (LEs) 150,848 —
Logic Array Blocks (LABs) 9,428 —
Embedded Memory (M9K blocks) 5,994 Kbits —
Embedded Multipliers (18x18) 320 —
Maximum User I/O Pins 413 —
Phase-Locked Loops (PLLs) 4 —
Process Technology 65 nm CMOS 65 nm low-power CMOS
Core Supply Voltage 1.2 V —
Maximum Operating Frequency 437.5 MHz —
External Memory Interfaces DDR2 SDRAM, QDRII+ SRAM —
Packhaging 780-ball FBGA (29x29 mm, 1.0 mm pitch) 780-ball FBGA (FineLine BGA)
Speed Grade C7 (commercial, -7 speed grade) —
Configuration Methods JTAG, Active Serial (AS), Passive Serial (PS) —
Temperature na Operasyon 0C to +85C (commercial) —
Tindminan RoHS Compliant Compliant
Logic Elements (LE) — 100,448
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Logic Array Blocks (LAB) — 6,278
Number of PLLs — 4
Maximum User I/O — 429
Core Supply Voltage (VCCINT) — 1.2 V
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Uri ng Pagpapasok — Surface Mount (BGA)
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

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