EP3CLS150F780I7N vs EP3CLS100F780C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS150F780I7N sa pamamagitan ng Intel at EP3CLS100F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS150F780I7N | EP3CLS100F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | — |
| Logic Elements | 150,848 | — |
| Embedded Memory Bits | 6,137,856 | — |
| Maximum User I/O | 413 | 429 |
| Packhaging | 780-FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Pins / Balls | 780 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Maximum Internal Frequency | 437 MHz | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Number of PLLs | 4 | 4 |
| Configuration Method | JTAG, Passive Serial (EPCS), Active Serial | — |
| Security Features | AES-128/256 bitstream encryption, JTAG security, tamper detection | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant | Compliant |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Device Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 100,448 |
| Total Memory Bits | — | 4,451,328 |
| Embedded Memory Blocks | — | M9K + M144K |
| Logic Array Blocks (LAB) | — | 6,278 |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Analog Supply (VCCA) | — | 2.5 V |
| Maximum Embedded Multipliers (18x18) | — | 244 |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm ball pitch |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Schemes | — | AS, PS, PP, JTAG |
| Lead-Free | — | Yes |