EP3SE110F1152C2NES vs EP3SE110F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C2NES sa pamamagitan ng Altera at EP3SE110F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F1152C2NES EP3SE110F1152C3N
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III Enhanced (EP3SE110) Stratix III E
Manufacturer Altera (Intel) —
Process Technology 65 nm 65 nm TSMC
Logic Elements 107,500 —
User I/O Pins 744 —
Core Voltage 1.1 V —
Maximum Operating Frequency 600 MHz —
Packhaging FC-FBGA-1152 (Flip-Chip) —
Uri ng Pagpapasok Surface Mount Surface Mount
Hanay ng Temperature na Operasyon [DATA_NEEDED: temperature grade] —
Speed Grade C2 C3
Uri ng Memory Embedded M9K blocks M9K and M144K block RAM
DSP Blocks Yes (variable-precision DSP) Yes (embedded multipliers)
Transceivers [DATA_NEEDED: transceiver count] —
Configuration SRAM-based, volatile —
Programming Interface JTAG / Passive Serial / Fast Passive Parallel —
Toolchain Quartus II (Stratix III support) —
Tindminan RoHS Non-Compliant (per Kynix listing) —
Series — Stratix III
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Temperature na Operasyon — 0 °C to 85 °C (commercial)
Style ng Pagpapasok — SMD/SMT (Tray)
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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