EP3SE110F1152C3N vs EP3SE110F1152C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C3N sa pamamagitan ng Intel at EP3SE110F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
EP3SE110F1152C3N ⚠ Huling PagbiliIntel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F1152C3N | EP3SE110F1152C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Series | Stratix III | — |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4300 |
| Total RAM Bits | 8,936,448 | — |
| User I/Os | 744 | — |
| Operating Frequency (max) | 500 MHz | — |
| Core Supply Voltage | 1.1 V nominal | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply range] | — |
| Process Technology | 65 nm TSMC | 65 nm |
| Package Type | FC-FBGA-1152 (flip-chip BGA) | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | 0C to +85C (Commercial) |
| Speed Grade | C3 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Style ng Pagpapasok | SMD/SMT (Tray) | — |
| DSP Blocks | Yes (embedded multipliers) | — |
| Uri ng Memory | M9K and M144K block RAM | — |
| External Memory Support | DDR/DDR2/DDR3 with read/write leveling | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | Yes (per Altera/Intel datasheet family convention) | — |
| Logic Elements | — | 107,500 |
| Memory Bits | — | 8,936,448 |
| Embedded Multipliers (18x18) | — | 896 |
| User I/O Pins | — | 744 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| Packhaging | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| Tindminan RoHS | — | Compliant |
| Level ng MSL | — | 3 (168 hours) |
| Design Software | — | Quartus II (v9.1 or later) |