EP3SE110F1152C3N vs EP3SE110F1152C4N 比較

詳細並排比較 EP3SE110F1152C3N 由 Intel 與 EP3SE110F1152C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ 最後購買機會
Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ 最後購買機會

規格比較

參數 EP3SE110F1152C3N EP3SE110F1152C4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 最後購買
Family Stratix III E Stratix III Enhanced (E)
Series Stratix III —
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) 4,300 4300
Total RAM Bits 8,936,448 —
User I/Os 744 —
Operating Frequency (max) 500 MHz —
Core Supply Voltage 1.1 V nominal —
I/O Supply Voltage [DATA_NEEDED: I/O supply range] —
Process Technology 65 nm TSMC 65 nm
Package Type FC-FBGA-1152 (flip-chip BGA) —
工作溫度 0 °C to 85 °C (commercial) 0C to +85C (Commercial)
Speed Grade C3 —
安裝類型 Surface Mount Surface Mount
安裝方式 SMD/SMT (Tray) —
DSP Blocks Yes (embedded multipliers) —
記憶體類型 M9K and M144K block RAM —
External Memory Support DDR/DDR2/DDR3 with read/write leveling —
Boundary Scan IEEE 1149.1 (JTAG) —
RoHS [DATA_NEEDED: RoHS status] —
Lead-Free Yes (per Altera/Intel datasheet family convention) —
Logic Elements — 107,500
Memory Bits — 8,936,448
Embedded Multipliers (18x18) — 896
User I/O Pins — 744
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
封裝 — 1152-ball FCBGA (Flip-Chip BGA)
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG / AES-256
RoHS 狀態 — Compliant
MSL 等級 — 3 (168 hours)
Design Software — Quartus II (v9.1 or later)

資料表與資源

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